WBG Pilot Line has kicked off - the consortium’s first meeting in Rome
| General information - UNIPRESS highlights |
We have launched work on the European WBG Pilot Line project - a joint “lab-to-fab” pilot line for wide-bandgap semiconductors (SiC, GaN, and UWBG) designed to strengthen the entire European value chain and accelerate industrial deployments in high value-added applications.
Our Institute contributes unique ammonothermal GaN substrates to the consortium and is developing manufacturing technologies for power and RF structures on 4-inch and larger GaN substrates as part of the Polish node of the pilot line.
The project is based on the infrastructure of partners from Italy, Poland, Sweden, Finland, France, Austria, and Germany, and is closely linked to the Chips for Europe initiative. More details under this link.
